File photo of Union Minister Ashwini Vaishnaw. | Photo credit: ANI
The government is aiming to produce hi-tech small chips with a 3-nanometer node – used in products such as modern smartphones and computers – by 2032, Union Minister Ashwini Vaishnaw said on Tuesday (Jan 27, 2026).
The minister said the government will focus on six categories of chips – computing, radio frequency (RF), networking, power, sensors and memory – under the second phase of a design-linked incentive scheme that will allow the country’s companies to have major control over the development of 70-75% of technology products.
“The level of 2032 is to achieve 3 nanometer chip manufacturing and design. Of course, we are still doing design today. But we should reach 3 nanometer manufacturing,” the minister said after a meeting with 24 chip design firms that were selected under a design-related incentive scheme.
Mr Vaishnaw said the government wants to focus on six major systems “to develop our complete semiconductor design ecosystem in a very comprehensive way”.
“Computing, RF, networks, power, sensors and memory – we will support academia and industry to come up with new ideas, new thinking and new solutions in these six main categories. By 2029, we will have the core capability to manufacture and design chips that are required in practically 70-75% of all applications in our country,” the minister said.
He said each sector will require a combination or permutation of these six types of chips.
Published – 27 Jan 2026 15:55 IST
