Mediatek launched two new chipsets for mobile devices on Tuesday. These chips, called the Dimente 7400 and Dimente 7400X, come in different forms of target smartphones. The Taiwan-based chip maker says its new processors are developed for mainstream devices to complement its flagship and premium products, such as the Dimenty 9400. According to the company, the Dimenty 7400 is the successor to the Dimenty 7300 last year, and the Dimenty 7400X is the Dimenty 7400x is used to power a foldable mobile experience.
Mediatek’s new chip has an octa-core architecture and an integrated neural processing unit (NPU) that powers artificial intelligence (AI) capabilities on mobile devices. The new Dimenty 7400 series chips are built on the Dimente 6400 processor, the company launched last week’s mid-range device.
Mediatek said Android devices, provided by the latest Dimastion 740 and Dimastics 7400X Soc, are expected to be available on the market in Q1 2025.
According to Mediatek, the Dimastics 7400 series chipsets have similar specifications, with the only distinguishing factor being its target device. The Dimente 7400 is built for normal equipment, while the Dimente 7400X is expected to power sizes with folding colors. These chips have an octa-core architecture based on TSMC-based 4NM process nodes. They have four ARM Cortex-A78 cores with a peak clock speed of 2.6GHz and four ARM Cortex-A55 cores operate at 2.0GHz and are complemented by the ARM MALI-G615 MC2 MC2 Graphics Processing Unit (GPU).
Mediatek’s building construction claims to reduce power by 14% to 36% compared to other competing processors. They also offer Mediatek Advanced Gaming Technology (MAGT) 3.0 support, which provides improved graphics performance, AI optimization for tuning gaming performance, reducing input lag and saving advanced power. Based on the AI capabilities provided by its predecessors, the Dimente 7400 and Dimenty 7400X chips, it also integrates Mediatek’s NPU 6.0, which is said to bring a 15% performance boost in AI applications.
The company said devices running these chipsets will support up to LPDDR5 RAM and can reach up to UFS 3.1 storage space.
Smartphones equipped with Dimente 7400 series chips will be able to support up to 200 megapixel camera sensors, leveraging the built-in Mediatek Imagiq 950 12-bit HDR ISP. It has an advanced hardware engine that claims to enhance image quality by reducing motion compensated noise (MCNR), hardware face detection (HWFD), and video HDR. It supports video capture and playback at 30 frames per second (FPS) at up to 4K resolution.
CHIP supports full HD+ resolution at 144Hz or full HD+ resolution display at 120Hz. For connectivity, the Dimente 7400 SOC brings Mediatek’s 5G R16 modem with downlink speeds up to 3.27Gbps and supports Wi-Fi 6e and Bluetooth 5.4. According to the company, the modem has 3CC Carrier Polymerization (3CC-CA), which utilizes Mediatek’s Ultrasave 3.0+ technology to provide 20% power consumption compared to competing chipsets.
Mediatek Dimente 7400 series chips also support satellite systems such as QZSS, Galileo, Beidou, Glonass, Navic and GPS.
