New Delhi: On Tuesday approved key production and infrastructure projects on Tuesdays of approximately approximately approximately £18 500 crore.
The approval includes four new semiconductor projects in Odisha, Pandjab and Andhra Pradesh; Hydroelectric project of the Title-II in Arnacal Pradesh; and expansion of the Lucknow metro in the next five years.
With Tuesday’s approval, the total number of semiconductor projects officially sanctioned Indian semiconductor mission was increased to 10, because Micron’s Memory Chip was approved in Gujarat in Sanand in Gujarat in June 2023.
There are four projects, including the only modernized India chip chip from Tata Electronics, two in Odisha and one in Assam, Uttar Pradesh, Pandjab and Andhra Pradesh.
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Semiconductor
The parties in the industry have noted that while four new projects may not include large capital expenditures, they are strategically important in the effort to consolidate investment in the first Indian semiconductor mission of almost $ 10 billion.
Ankush Wadhera, CEO and Partner and India Semiconductor Practice Head in Boston Consulting Group (BCG), said the largest project in Tuesday’s notifications, SICSEM Fold Fab chip, “is essential in various industrial applications with high military.”
“The list of approved projects until yesterday had one silicone FAB, chips testing and packaging settings and four chips and assembly races. Even in the modernization of the center SCL (semiconductor laboratory, Mohali), she said the new announcements would help,” he said.
Wadhera added that the new announcements could also increase the pace of development and output in traditional outsources of assembly assemblies and tests (Osat).
Four newly approved proposals carry a cumulative investment around £4,600 crore and are expected to generate employment for approximately 2,034 qualified experts according to an official statement.
SICSEM PVT LTD. A semiconductor plant Silicon Carbide Semiconductor will be set up in BhubaneSwar.
“The Sicsem Project in Odisha is an Integrated Semiconductor Project, WHICH MEANS THAT WILL HAVE BOTH AND COMPound Semiconductor Fabrication Plant, As Well As A Chip Testing and Packaging Unit. The Second Odisha Project With Hips is an Advanced Packaging Plant for Glass Substrates, Which are applicable in Crucial Industries.
Folded semiconductors are made of silicon combined with other elements. They require various manufacturing techniques and are used primarily in strategic industrial applications such as the start of space, high -intensity industry, such as automotive processions and railways, and durable systems including energy networks and oil platforms.
Ajai Chowdhry, an industrial veteran and co -founder, HCL, added that the announced “Mark very good step of the center to diversify the range of semiconductor projects.”
“The folded FAB chip was absolutely an hour and the center could be well made with a well -made strategy announcement. The announcement also showed the scope of the excellent semiconductor policy state and many countries offer benefits for technical companies in the form of land and other benefits.
The Solutions PVT LTD heterogeneous integration package creates a vertically integrated advanced packaging and a built -in glass substrate device in Bhubaneswar, Odisha, with a scheduled annual capacity of approximately 69,600 glass panel substrates, 50 million units and 13,200 3dhi modulus.
The Advanced System in Package Technologies (ASIP) will set up a Semiconductor manufacturing unit in Andhra Pradesh as part of a technological connection with APACT CO. LTD in South Korea with an annual capacity of 96 million units. The products produced will serve applications on mobile phones, set-top boxes, automotive systems and other electronic products.
“The ASIP Andhra Pradesh project is also a project of advanced packaging for industrial chips, while the Continental-Larže-Large project is expanding the oldest and running of the oldest race in India, India.
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Infrastructure pressure
Separately approved by the Cabinet Committee for Economic Affairs (CCEA) Investment £8 146,21 CRORE for the construction of the project Tit-II Hydro Electric Project (HEP) in the district of Shi Yomi in Arunacal Pradesh with an estimated timeline completion of 72 months.
The 700 MW project is expected to generate 2,738.06 million units of energy each. It will be implemented through a common company between North Eastern Electric Power Corp. Ltd. (Neepco) and the government of Aruunacal Pradesh.
The Center will provide £458.79 Crore in budget support for infrastructure permission such as roads, bridges and transmission lines, along with £436.13 Crore as a central financial assistance with the share of its own capital, according to another official statement.
ARUNACHAL PRADESH will benefit 12% of free energy and another 1% allocation for the Ladf Fund (LADF), said.
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This development is equal to the government with the aim of reaching the capacity of non -formal capacity of energy by 2030 500 GW of non -formal energy capacity within its transition to the energy transition and carbon emissions with pure zero.
In another significant increase in infrastructure, the Union Phase-1B Rail Metro project, which includes a corridor of 11.16 kilometers with 12 stations, seven underground and five elevated, approved the Cabinet of the Union Phase-1B project. After operation, the Lucknow metro network will expand to 34 km. The project has estimated costs of £5 801 crore.
(Tagstotranslate) India semiconductor projects
